Producing chips in a fabless fashion is quite simple
1) You create the design
2) You send the design off to a fab to be made
Even many of the chips from traditional manufacturers are now made in “third party” fabs such as TSMC. Hardly surprising when a state of the art fab is some $7B.
XMOS chips are effectively fabless.
The Kalray chip seems to have a fair bit of inheritance from the ST VLIW stuff that superceded the transputer, which is hardly surprising since most of the staff CVs are ex ST/ST-Ericsson.
Producing the chips is not cheap, because of mask costs. However, there are low volume schemes whereby several customers chips are put on the same wafer to cut costs.
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I poked around and found
which had some details but no data sheet. My guess is that their design hasn't totally gelled. How does one go about producing chips in a "fabless" fashion? Is each prototype just a one-off, like ordering boards?
On Mar 16, 2013, at 2:35 AM, ael <A.E.Lawrence@xxxxxxxxxxx> wrote:
On Fri, Mar 15, 2013 at 11:27:32PM +0100, Herman Roebbers wrote: